The American Surveyor

RIEGL to Attend AGU 2015

 

Immediate Release

Orlando, FL

December 9, 2015

 

 

                                           

RIEGL will be attending the AGU 2015 Fall Meeting!

 

The AGU 2015 Fall Meeting will be held at the Moscone Center in San Francisco, California from December 14-18, 2015.

 

With nearly 24,000 attendees, the AGU Fall Meeting is the largest Earth and space science meeting in the world. The AGU Fall Meeting brings together the entire Earth and space science community for discussions of emerging trends and the latest research. With more than 1700 sessions, the AGU Fall Meeting’s scientific program spans the Earth and space sciences, offering something for everyone no matter their scientific discipline.

 

Please join the RIEGL experts at Booth 636 to learn about the broad RIEGL product portfolio for terrestrial, mobile, airborne, and UAV-based laser scanning. Our experts are available to discuss our brand-new RIEGL VZ-400i terrestrial laser scanner, which is redefining productivity!

 

Stop by our booth to learn about how our hardware and software solutions can help you and your business!

 

RIEGL is looking forward to a successful conference and to welcoming you to the AGU 2015 Fall Meeting!

 

 

 

About RIEGL:

 

RIEGL delivers cutting edge technology in airborne, mobile, terrestrial and the newest unmanned laser scanning solutions. From your initial purchase, to integration of the systems, as well as training and support, RIEGL stands out as a leader in the industry. The key factor to RIEGL‘s success is providing complete reliability and support to our customers.

 

As a result of this success, RIEGL is recognized as the performance leader in the mobile mapping, civil infrastructure, airborne scanning, unmanned, hydrographic, bathymetric, mining and terrestrial based industries. Our instruments are well known for their ruggedness and reliability under demanding environmental conditions.  RIEGL‘s various 3D scanners offer a wide array of performance characteristics and serve as a platform for continuing "Innovation in 3D" for the laser scanning business.

 


 

 

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