Leica Geosystems Releases DSW700 Scanner

Leica Geosystems Releases DSW700 Scanner with Faster Scanning Speeds

Atlanta, Georgia, USA — 12 July 2004 – Leica Geosystems GIS & Mapping, LLC is pleased to announce the release of the DSW700 Digital Scanning Workstation. The latest version of the popular DSW scanner series features a 30 percent improvement on scanning speeds, as well as improved radiometric quality and lower cost of operation. The DSW700 is a high-performance photogrammetric film scanner for both cut film and roll film. It uses state-of-the-art technology to produce output that is both geometrically and radiometrically accurate while maximizing performance, increasing reliability and reducing costs. The scanner is helpful to photogrammetric power users who need the highest throughput, including both unattended scanning of roll film and easy change of pixel size from one job to the next. The DSW700 includes various features, including:
• Fast, precise XY stage generates top quality image without resampling
• Optional film transport for rolls up to 500 feet (152m) long; autonomous operation allows operator freedom for other tasks
• Pixel size physically changeable in range 4.5-22 µm without resampling
• High illumination enables very dense media to be scanned satisfactorily
• New electronic switching of red, green or blue LEDs
• High geometric precision of stage and sensor
• High slew speeds, fast host computer, refined mechanics and sophisticated software facilitate rapid scanning
• Superb radiometric performance: 12 bit output, full fill factor CCD cells, over 3.0 OD with exposure time control
• New optical technology virtually eliminates Newton rings
• Backlight to inspect imagery and read exposure numbers
• Popular image formats compatible with popular image processing, digital photogrammetry, desktop publishing, CAD and GIS packages, including the JPEG2000 format

For more information about the DSW700 or other products and services from Leica Geosystems GIS & Mapping, call: +1 404 248 9000, toll free: +1 877 463 7327, or visit: www.gis.leica-geosystems.com.